Scientists at the Indian Institute of Science (IISc) have achieved a significant breakthrough by developing a flexible composite semiconductor material using inkjet printing technology. This innovative material holds immense potential for applications in flexible displays, foldable phones, and wearable electronics. Unlike traditional semiconductor devices, which lack flexibility and strain tolerance, the newly developed composite semiconductor combines the advantageous properties of a water-insoluble polymer and indium oxide.
The Limitations of Traditional Semiconductor Devices:
Traditional semiconductor devices used in the display industry, such as transistors, are typically made of amorphous silicon or amorphous oxides. However, these materials lack the necessary flexibility and strain tolerance required for applications in flexible electronics. Although the addition of polymers to oxide semiconductors can enhance their flexibility, there is a limit to how much polymer can be added without compromising the performance of the semiconductor.
Inkjet Printing: Revolutionizing Semiconductor Fabrication:
In the current study, researchers at IISc have successfully addressed the limitations of traditional semiconductor devices by fabricating a composite semiconductor using a solution-process technique known as inkjet printing. This approach allows the researchers to incorporate a significant amount of polymer, up to 40 percent of the material weight, into the composite. Importantly, this technique preserves the semiconducting properties of the oxide semiconductor, ensuring its performance remains unaltered.
The Flexibility Factor:
By adding a large quantity of a water-insoluble polymer, such as ethyl cellulose, to the oxide semiconductor, the researchers achieved an unprecedented level of flexibility in the composite semiconductor. This flexible nature enables the material to be easily bent and folded without compromising its performance. The breakthrough paves the way for the development of flexible electronic devices that can conform to various shapes and sizes.
The Design of the Composite Semiconductor:
The composite semiconductor is composed of two primary materials: a water-insoluble polymer and indium oxide, a semiconductor material known for its excellent electronic transport properties. To design the material, the researchers combined the polymer with the oxide precursor in a manner that created interconnected oxide nanoparticle channels. These channels enable the smooth movement of electrons from one end of a transistor to the other, ensuring a steady flow of current. The selection of the appropriate water-insoluble polymer that does not mix with the oxide lattice during fabrication is critical in forming these interconnected pathways.
Applications and Future Implications:
The development of this flexible composite semiconductor material using inkjet printing technology opens up a myriad of possibilities for various electronic devices. Flexible displays, foldable phones, and wearable electronics can greatly benefit from this breakthrough. The ability to create high-performance semiconductor devices that can be bent and folded without compromising functionality presents exciting opportunities for the future of electronics. The composite semiconductor’s versatility and adaptability to different form factors make it an ideal candidate for next-generation electronic devices.