On 22 July 2026 Paras Semiconductors (subsidiary of Paras Defence and Space Technologies Ltd) signed an MoU with the Madhya Pradesh State Electronics Development Corporation to set up a greenfield OSAT facility in the Indore‑Ujjain region.
Project snapshot
- Investment: Proposed ₹6,200 crore (about USD 644 million).
- Location: Indore‑Ujjain industrial region, Madhya Pradesh.
- Employment: Expected more than 2,500 direct jobs.
- Prominence: Greenfield Outsourced Semiconductor Assembly and Test (OSAT) facility focused on advanced packaging.
OSAT and advanced packaging
- OSAT defined: Back‑end segment covering assembly, packaging and testing of semiconductor dies.
- 2.5D integration: Uses an interposer to place multiple dies side‑by‑side with high‑density interconnects.
- 3D integration: Vertical stacking of dies with through‑silicon vias for reduced footprint and latency.
- Hybrid bonding & fan‑out: Hybrid bonding enables face‑to‑face die joins; fan‑out increases I/O density without large substrates.
- Other processes: Chiplet integration, wafer bumping and flip‑chip assembly.
Applications & ecosystem linkages
- Target devices: Sensor devices, optical/optronic systems and prospective AI accelerators.
- Supply chain: OSAT units form the back‑end layer distinct from wafer fabrication (front‑end).
IASPOINT Booster Facts
- India Semiconductor Mission: Government programme to promote semiconductor and display manufacturing in India.
- Packaging role: Advanced packaging enables heterogeneous integration and improved power‑performance‑area metrics.