UNIT 1: Science, Technology and Innovation Ecosystem in India

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UNIT 10: Applied Emerging Technologies for Governance, Economy and Society

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India Semiconductor Mission

The India Semiconductor Mission (ISM) is a specialized, autonomous business division established within the Digital India Corporation under the Ministry of Electronics and Information Technology (MeitY). Launched with an initial financial allocation of ₹76,000 crore, the mission functions as the nodal administrative agency responsible for catalyzing a robust semiconductor and display manufacturing ecosystem. The institutional mandate of ISM is to transition India from a consumer of microelectronics into a leading, self-reliant global manufacturing node, thereby securing technological sovereignty and integrating the country into the high-technology global value chain.

Policy Structure and Sub-Schemes

The ISM implements a comprehensive structural policy engine through a series of modified incentive frameworks offering uniform fiscal support of 50% of the project cost on a pari-passu basis across all approved verticals.

Modified Scheme for Setting Up Semiconductor Fabs

Provides fiscal support to corporate entities for setting up silicon-based wafer fabrication plants. It applies uniformly to all technology nodes, including advanced nodes ( 7 nm) as well as trailing-edge and legacy nodes ( 28 nm), which are essential for automotive and power sectors.

Modified Scheme for Setting Up Display Fabs

Aims to attract large-scale capital investments to manufacture flat-panel displays, such as TFT-LCD, OLED, and MicroLED modules. Display components account for up to half the cost of electronic consumer units, making domestic fabrication key to reducing structural import bills.

Modified Scheme for Compound Semiconductors, Silicon Photonics, and Sensors

Focuses on next-generation materials and niche optoelectronic domains. It provides capital support for setting up Gallium Nitride (GaN) foundries, Silicon Carbide (SiC) fabs, Silicon Photonics units, and Micro-Electro-Mechanical Systems (MEMS) sensors.

Modified Scheme for Packaging (ATMP and OSAT)

Targets the backend segment of chip production. It subsidizes the capital expenditures required to set up Assembly, Testing, Marking, and Packaging (ATMP) units and third-party Outsourced Semiconductor Assembly and Test (OSAT) centers.

Design Linked Incentive (DLI) Scheme

Provides operational infrastructure, design access, and financial incentives to domestic fabless semiconductor startups.

  • Product Design Linked Incentive: Reimburses up to 50% of eligible design expenditure.
  • Deployment Linked Incentive: Provides 4% to 6% of net sales turnover over five years to companies commercializing indigenous microprocessors or system-on-chips (SoCs).

Paradigm Shift: Transition to ISM 2.0

As the country completes the setup of initial projects, the policy architecture has expanded into ISM 2.0. Supported by an enhanced single-year financial layout of ₹8,000 crore in the Union Budget, this phase focuses on upstream components and long-term self-sufficiency.

Equipment and Materials Manufacturing

Shifts focus toward building a domestic supply chain for critical raw inputs, specializing in electronic gases, chemical photoresists, specialized quartzware, high-purity silicon ingots, and precision components for lithography hardware.

Indigenous Intellectual Property (IP) and Full-Stack Design

Prioritizes the creation and ownership of foundational Indian core architectures, ensuring local entities own the patent rights for chip designs rather than relying entirely on licensed foreign IP blocks.

Academic Infrastructure and Applied R&D

Financially anchors industry-led research hubs and specialized training networks across 315 premier academic institutions to scale up Very Large Scale Integration (VLSI) engineering talent, aiming to secure a future-ready technical workforce.

Comprehensive Landscape of Approved Projects

The cumulative institutional approvals under the ISM network include 12 major semiconductor manufacturing units distributed across six states, with combined investment commitments exceeding ₹1.64 lakh crore.

S.NoProject Unit NameCorporate Promoters / Technology PartnersProject Typology & Core NodeStrategic LocationKey Target Applications
1Tata Electronics Silicon FabTata Electronics & PSMC (Taiwan)Pure-Play Foundry; Mature 28nm NodeDholera, GujaratAutomotive MCUs, Power ICs, Consumer Tech
2Tata Semiconductor Assembly (TSAT)Tata GroupMega OSAT Packaging UnitMorigaon, AssamAutomotive, Smart Electric Vehicles
3Micron ATMP FacilityMicron Technology (USA)Captive Memory Packaging (DRAM/NAND)Sanand, GujaratData Centers, High-Volume Solid-State Memory
4CG Power OSAT UnitCG Power, Renesas (Japan) & Stars (Thailand)Commercial OSAT ComplexSanand, GujaratIndustrial Power Electronics, Legacy Analog Chips
5Kaynes Semicon OSATKaynes TechnologyCommercial OSAT PlantSanand, GujaratIoT Modules, Telecom Systems, Industrial Automation
6SiCSem FabsSiCSem Pvt. Ltd & Clas-SiC (UK)Compound Semiconductor Fab (Silicon Carbide)Bhubaneswar, OdishaHigh-Voltage EV Inverters, Green Energy Grids
7Heterogenous Integration Packaging3D Glass Solutions Inc. (USA)Advanced 3D Packaging (Glass Substrates)Bhubaneswar, OdishaAI Data Accelerators, 5G/6G RF Hardware
8Crystal Matrix FacilityCrystal Matrix LimitedCompound Fab & ATMP (Gallium Nitride)Dholera, GujaratMini/Micro-LED Displays, Smart Wearables, XR Glasses
9Suchi Semicon UnitSuchi Semicon Private LimitedCommercial OSAT ComplexSurat, GujaratPower Management, Discretes, Consumer Appliances
10India Chip PackagingHCL–Foxconn Group Joint VentureMulti-Chip Packaging HubJewar, Uttar PradeshTelecom Infrastructure, Connected Vehicles
11CDIL Brownfield FabContinental Device India LtdPower Discrete Component FoundryMohali, PunjabAerospace Systems, Smart Mobility
12Rajasthan Semi-ComplexState-led Public-Private InitiativeSpecialized Automotive PackagingNeemrana, RajasthanSmart Meters, Industrial Sensing Arrays

Strategic Geopolitical and Economic Impact

Mitigating Weaponized Supply Chains

The semiconductor value chain is prone to systemic disruptions. Domestic fabrication shields India from geopolitical chip blockades, ensuring an uninterrupted supply of electronic components for strategic defense platforms, missile tracking arrays, and internal communications networks.

Resolving the Electronics Import Imbalance

India’s electronic consumption is projected to drive a massive domestic semiconductor market worth $100–110 billion by 2030. Cultivating local foundries and packaging ecosystems reduces reliance on foreign electronic imports, improving the national current account deficit.

High-Tech Employment and Industrial Multiplier

Beyond creating direct employment for over 2,230 highly skilled professionals via current project pipelines, the semiconductor mission serves as an industrial multiplier. Every single operational cleanroom fab attracts surrounding clusters of chemical suppliers, logistics centers, gas plants, and packaging foundries.

Technical Trivia for UPSC Prelims

Pari-Passu Disbursement Mechanism

A financial management method implemented under ISM where central subsidy disbursements are made concurrently alongside the private investor’s capital deployment. This ensures real-time project auditing, prevents capital diversion, and accelerates fabrication plant construction timelines.

Silicon Carbide (SiC) vs. Gallium Nitride (GaN)

These wide-bandgap compound semiconductors are the focus of ISM’s niche manufacturing push. SiC withstands high voltages and thermal loads, making it ideal for electric vehicle power systems and trains. GaN operates at higher switching frequencies, making it the bedrock material for 5G telecommunications and advanced MicroLED displays.

Fabless Semiconductor Model

A business framework where an enterprise specializes exclusively in designing the architecture and functional layouts of integrated circuits while outsourcing the actual physical chemical fabrication to independent foundries (such as TSMC) or third-party OSAT facilities. The DLI scheme specifically aims to mature this segment within India.

Last Modified: June 17, 2026

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